EN IEC 61189-2-803 EUROPEANSTANDARD NORME EUROPEENNE EUROPAISCHE NORM September 2023 ICS 31.180 English Version Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023) Methodes d'essai pour les materiaux électriques, les cartes Prufverfahren fur Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2- imprimées etautres structures d'interconnexion et ensembles - Partie 2-803: Methodes d'essai pour la 803: Prufverfahren fur die Z-Achsen-Ausdehnung von dilatation suivant I'axe Z des materiaux de base et des Basismaterialien und Leiterplatten (IEC 61189-2-803:2023) cartes imprimees (IEC61189-2-803:2023) ThisEuropean Standard was approved byCENELEC on 2023-08-30.CENELECmembersarebound to complywith the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC ManagementCentreortoanyCENELECmember. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC membersarethe nationalelectrotechnical committees ofAustria, Belgium,Bulgaria, Croatia, Cyprus,the CzechRepublic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkiye and the United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comite Europeen de Normalisation Electrotechnique Europaisches Komitee fur Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels Ref. No. EN IEC 61189-2-803:2023 E EN IEC 61189-2-803:2023 (E) European foreword "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as ENIEC 61189-2-803:2023. The following dates are fixed: latest date by which the document has to be implemented at national (dop) 2024-05-30 latest date by which the national standards conflictingwith the (dow)2026-08-30 document have to be withdrawn Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights complete listing of these bodies can be found on the CENELEC website. Endorsement notice The text of the International Standard IEC 61189-2-803:2023 was approved by CENELEC as a European Standard without any modification 2 EN IEC 61189-2-803:2023 (E) Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cencenelec.eu Publication Year Year Title EN/HD IEC 60194-1 Printed boards design, manufacture and - assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies 3